Wet etching and releasing of MEMS

Yi Ou; Shali Shi; Chaobo Li; Binbin Jiao; Dapeng Chen

Wet etching and releasing of MEMS

Yi Ou
, Shali Shi
, Chaobo Li
, Binbin Jiao
, Dapeng Chen

CAS - Institute of Microelectronics

科研成果: 期刊稿件 › 文章 › 同行评审

摘要

The FP resonant cavity as a microelectromechanical system (MEMS) device based on silicon is introduced. It is fabricated using silicon micro-machined technology. According the specifications of this kind micro-structure, analyzed some questions in the wet etching and releasing. According to the different situation, the design of the device and the technology are improved. And its feasibility is confirmed by the experiment.

源语言	英语
页（从-至）	347-350
页数	4
期刊	Pan Tao Ti Hsueh Pao/Chinese Journal of Semiconductors
卷	27
期	SUPPL.
出版状态	已出版 - 12月 2006
已对外发布	是

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@article{ae626414fb694dab9c075a941f4173b9,

title = "Wet etching and releasing of MEMS",

abstract = "The FP resonant cavity as a microelectromechanical system (MEMS) device based on silicon is introduced. It is fabricated using silicon micro-machined technology. According the specifications of this kind micro-structure, analyzed some questions in the wet etching and releasing. According to the different situation, the design of the device and the technology are improved. And its feasibility is confirmed by the experiment.",

keywords = "Isolation groove, MEMS, Releasing, Sacrificial layer, Wet etching",

author = "Yi Ou and Shali Shi and Chaobo Li and Binbin Jiao and Dapeng Chen",

year = "2006",

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language = "英语",

volume = "27",

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TY - JOUR

T1 - Wet etching and releasing of MEMS

AU - Ou, Yi

AU - Shi, Shali

AU - Li, Chaobo

AU - Jiao, Binbin

AU - Chen, Dapeng

PY - 2006/12

Y1 - 2006/12

N2 - The FP resonant cavity as a microelectromechanical system (MEMS) device based on silicon is introduced. It is fabricated using silicon micro-machined technology. According the specifications of this kind micro-structure, analyzed some questions in the wet etching and releasing. According to the different situation, the design of the device and the technology are improved. And its feasibility is confirmed by the experiment.

AB - The FP resonant cavity as a microelectromechanical system (MEMS) device based on silicon is introduced. It is fabricated using silicon micro-machined technology. According the specifications of this kind micro-structure, analyzed some questions in the wet etching and releasing. According to the different situation, the design of the device and the technology are improved. And its feasibility is confirmed by the experiment.

KW - Isolation groove

KW - MEMS

KW - Releasing

KW - Sacrificial layer

KW - Wet etching

UR - https://www.scopus.com/pages/publications/33847793780

M3 - 文章

AN - SCOPUS:33847793780

SN - 0253-4177

VL - 27

SP - 347

EP - 350

JO - Pan Tao Ti Hsueh Pao/Chinese Journal of Semiconductors

JF - Pan Tao Ti Hsueh Pao/Chinese Journal of Semiconductors

IS - SUPPL.

ER -

Wet etching and releasing of MEMS

摘要

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