摘要
This paper presents a Very large scale integration (VLSI) design method for Three-dimensional (3D) depth perception chip based on infrared coding structure light. The primary sub-modules on the chip contain the speckle pattern preprocessing module, block-matching disparity estimation, depth mapping and post-processing. The chip employs pipelining technology, and after Application specific integrated circuit (ASIC) verification, it proves that our chip has more advantages in performance of depth precision (12bits, 1mm @ 1m), image resolution (1280×960), time delay (less than 17ms), range limit (0.4~6m). It also can generate more stable and smooth depth map in real-time, which can be used in 3D recognition, motion capture or scene perception.
| 源语言 | 英语 |
|---|---|
| 页(从-至) | 556-560 |
| 页数 | 5 |
| 期刊 | Chinese Journal of Electronics |
| 卷 | 30 |
| 期 | 3 |
| DOI | |
| 出版状态 | 已出版 - 5月 2021 |
学术指纹
探究 'VLSI Design for High-Precision Three-Dimensional Depth Perception Chip' 的科研主题。它们共同构成独一无二的指纹。引用此
- APA
- Author
- BIBTEX
- Harvard
- Standard
- RIS
- Vancouver