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UV-assisted thermal imprint of SU-8 using nickel mold

  • National Institute of Advanced Industrial Science and Technology

科研成果: 书/报告/会议事项章节会议稿件同行评审

1 引用 (Scopus)

摘要

As an epoxy-based negative photoresist, SU-8 is being widely used for various permanent use MEMS devices due to its excellent thermal and chemical stability. Due to its UV curability, classical structuring methods of SU-8 are based on UV photolithography and UV imprint processes. This study describes a process to form a micro pattern in SU-8 film that is based on thermal imprinting. One of major obstacles in the process is that SU-8 is easy to deform during and after releasing a mold because the mold is separated from the SU-8 in the un-cured state. In this study, series of imprint tests using a Ni m old were performed with the un-cured SU-8 samples pre-treated with UV light for different exposure time, and their results were compared each other in terms of the replication quality. As a result, a SU-8 sample pre-treated with UV light for 8 s resulted in the best replication quality for given imprint conditions, and we could successfully replicate micro patterns with the aspect ratio of 2.5 (25 μm depth and 10 μ line-and-spacing) in SU-8 resist.

源语言英语
主期刊名ICSMA 2008 - International Conference on Smart Manufacturing Application
389-392
页数4
DOI
出版状态已出版 - 2008
已对外发布
活动International Conference on Smart Manufacturing Application, ICSMA 2008 - Gyeonggi-do, 韩国
期限: 9 4月 200811 4月 2008

丛书

姓名ICSMA 2008 - International Conference on Smart Manufacturing Application

会议

会议International Conference on Smart Manufacturing Application, ICSMA 2008
国家/地区韩国
Gyeonggi-do
时期9/04/0811/04/08

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