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Trap State Modulation via Strong Electron-Withdrawing Groups for Enhanced Vacuum Surface Insulation of All-Organic Polyimide

  • Changchun Qi
  • , Xiong Yang
  • , Jiufeng Dong
  • , Guangyu Sun
  • , Wenrui Li
  • , Fangzheng Zou
  • , Ruitong Zhou
  • , Xiaogang Qin
  • , Baipeng Song
  • , Guanjun Zhang
  • Xi'an Jiaotong University
  • Southern University of Science and Technology
  • Swiss Federal Institute of Technology Lausanne
  • Chinese Academy of Sciences

科研成果: 期刊稿件文章同行评审

6 引用 (Scopus)

摘要

Polyimide (PI), a high-performance polymer widely employed in aerospace applications due to its superior electrical insulation, processability, and long-term stability, faces operational challenges at vacuum-solid interfaces. Under extreme space conditions, vacuum flashover phenomena frequently occur at PI interfaces during spacecraft operation, critically jeopardizing the reliability of the onboard electronic components. This study demonstrates a molecular engineering strategy to suppress secondary electron emission and improve surface insulation by modulating trap states through strong electron-withdrawing groups. Two all-organic specialty PI films were systematically developed via a strategic molecular structure design and subsequently fabricated. These films incorporate strong electron-withdrawing groups (e.g., −SO2– and −CF3), which effectively enhance trap densities and deepen trap levels, thereby suppressing the secondary electron multiplication process. Both specialty PI films demonstrated significantly enhanced vacuum surface flashover thresholds, with their vacuum flashover voltages Uhoincreased by 12.65 and 17.08% compared to pristine PI, respectively. The proposed molecular design paradigm provides a fundamental advancement in dielectric materials engineering, addressing the critical need for high-voltage tolerant insulation systems in next-generation spacecraft requiring elevated operational power and extended mission durations.

源语言英语
页(从-至)48956-48966
页数11
期刊ACS Applied Materials and Interfaces
17
34
DOI
出版状态已出版 - 27 8月 2025

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