Transgranular slits in aluminum interconnects caused by thermal stress and electric current

W. Wang; Z. Suo; T. H. Hao

doi:10.1557/proc-338-415

Transgranular slits in aluminum interconnects caused by thermal stress and electric current

W. Wang
, Z. Suo
, T. H. Hao

University of California at Santa Barbara

科研成果: 期刊稿件 › 会议文章 › 同行评审

2 引用（Scopus）

摘要

An aluminum interconnect can fail by a transgranular slit. We show how a rounded void collapses to such a slit, as atoms diffuse on the void surface, driven by electric current, thermal stress, and surface energy. We use a variational principle to simulate the shape evolution, and identify the critical conditions to trigger the shape instability.

源语言	英语
页（从-至）	415-420
页数	6
期刊	Materials Research Society Symposium - Proceedings
卷	338
DOI	https://doi.org/10.1557/proc-338-415
出版状态	已出版 - 1994
已对外发布	是
活动	Proceedings of the 1994 MRS Spring Meeting - San Francisco, CA, USA 期限: 5 4月 1994 → 8 4月 1994

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title = "Transgranular slits in aluminum interconnects caused by thermal stress and electric current",

abstract = "An aluminum interconnect can fail by a transgranular slit. We show how a rounded void collapses to such a slit, as atoms diffuse on the void surface, driven by electric current, thermal stress, and surface energy. We use a variational principle to simulate the shape evolution, and identify the critical conditions to trigger the shape instability.",

author = "W. Wang and Z. Suo and Hao, \{T. H.\}",

year = "1994",

doi = "10.1557/proc-338-415",

language = "英语",

volume = "338",

pages = "415--420",

journal = "Materials Research Society Symposium - Proceedings",

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note = "Proceedings of the 1994 MRS Spring Meeting ; Conference date: 05-04-1994 Through 08-04-1994",

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TY - JOUR

T1 - Transgranular slits in aluminum interconnects caused by thermal stress and electric current

AU - Wang, W.

AU - Suo, Z.

AU - Hao, T. H.

PY - 1994

Y1 - 1994

N2 - An aluminum interconnect can fail by a transgranular slit. We show how a rounded void collapses to such a slit, as atoms diffuse on the void surface, driven by electric current, thermal stress, and surface energy. We use a variational principle to simulate the shape evolution, and identify the critical conditions to trigger the shape instability.

AB - An aluminum interconnect can fail by a transgranular slit. We show how a rounded void collapses to such a slit, as atoms diffuse on the void surface, driven by electric current, thermal stress, and surface energy. We use a variational principle to simulate the shape evolution, and identify the critical conditions to trigger the shape instability.

UR - https://www.scopus.com/pages/publications/0028714256

U2 - 10.1557/proc-338-415

DO - 10.1557/proc-338-415

M3 - 会议文章

AN - SCOPUS:0028714256

SN - 0272-9172

VL - 338

SP - 415

EP - 420

JO - Materials Research Society Symposium - Proceedings

JF - Materials Research Society Symposium - Proceedings

T2 - Proceedings of the 1994 MRS Spring Meeting

Y2 - 5 April 1994 through 8 April 1994

ER -

Transgranular slits in aluminum interconnects caused by thermal stress and electric current

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