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Three-In-One Chip Designed for Wide Range Vacuum Sensing

  • Jingping Qiao
  • , Ruiwenliu
  • , Yanmei Kong
  • , Binbin Jiao
  • , Zhanqiang Hou
  • , Feng Han
  • , Shichang Yun
  • , Yuxin Ye
  • , Xangbin Du
  • , Zilong Wang
  • , Sibo Li
  • Chinese Academy of Sciences
  • National University of Defense Technology
  • Xi'an Jiaotong University

科研成果: 书/报告/会议事项章节会议稿件同行评审

摘要

This is the first time that a MEMS piezoresistive low-vacuum sensitive structure, a MEMS Pirani mediumvacuum sensitive structure, and a MEMS resonant highvacuum sensitive structure were integrated and designed on a single chip. Wide-range and high-accuracy vacuum measurements can be realized by this integrated chip. To avoid mutual crosstalk between the three sensitive mechanisms leading to chip failure, thermal isolation, and electromagnetic shielding structures are designed to suppress thermal crosstalk and electromagnetic shielding crosstalk. Capable of vacuum measurement from high vacuum to atmospheric pressure.

源语言英语
主期刊名2025 IEEE 20th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2025
出版商Institute of Electrical and Electronics Engineers Inc.
288-291
页数4
ISBN(电子版)9798331599126
DOI
出版状态已出版 - 2025
已对外发布
活动20th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2025 - Zhuhai, 中国
期限: 11 5月 202514 5月 2025

丛书

姓名2025 IEEE 20th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2025

会议

会议20th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2025
国家/地区中国
Zhuhai
时期11/05/2514/05/25

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