TY - JOUR
T1 - Three-Dimensional Printed Ultrabroadband Terahertz Metamaterial Absorbers
AU - Shen, Zhonglei
AU - Li, Shengnan
AU - Xu, Yafei
AU - Yin, Wei
AU - Zhang, Liuyang
AU - Chen, Xuefeng
N1 - Publisher Copyright:
© 2021 American Physical Society.
PY - 2021/7
Y1 - 2021/7
N2 - Terahertz (THz) absorbers have recently attracted extensive attention for their promising potential in various applications; however, many existing THz absorbers are restrained by their narrow bandwidth and complicated and costly fabrication process that renders them unfavorable for practical devices. Herein, we propose a stereoscopic multilayered ultrabroadband THz metamaterial absorber by stacking multilayer concentric resonators on different-level top surfaces of a monolithic three-dimensional (3D) pagodalike substrate. By taking full advantage of the 3D printing technique, the proposed ultrabroadband absorber can be produced efficiently in an easy three-step process that overcomes the fabrication complexities of traditional multistep photolithography processes. Additionally, the feasibility and robustness of the proposed fabrication method for common out-of-plane THz narrowband absorbers are also validated, and the absorption capacities of the 3D printed absorbers are numerically and experimentally elucidated. These results might provide an efficient concept and fabrication technique to stimulate many potential applications in emerging THz technologies, such as sensing, imaging, and wireless communications.
AB - Terahertz (THz) absorbers have recently attracted extensive attention for their promising potential in various applications; however, many existing THz absorbers are restrained by their narrow bandwidth and complicated and costly fabrication process that renders them unfavorable for practical devices. Herein, we propose a stereoscopic multilayered ultrabroadband THz metamaterial absorber by stacking multilayer concentric resonators on different-level top surfaces of a monolithic three-dimensional (3D) pagodalike substrate. By taking full advantage of the 3D printing technique, the proposed ultrabroadband absorber can be produced efficiently in an easy three-step process that overcomes the fabrication complexities of traditional multistep photolithography processes. Additionally, the feasibility and robustness of the proposed fabrication method for common out-of-plane THz narrowband absorbers are also validated, and the absorption capacities of the 3D printed absorbers are numerically and experimentally elucidated. These results might provide an efficient concept and fabrication technique to stimulate many potential applications in emerging THz technologies, such as sensing, imaging, and wireless communications.
UR - https://www.scopus.com/pages/publications/85112636033
U2 - 10.1103/PhysRevApplied.16.014066
DO - 10.1103/PhysRevApplied.16.014066
M3 - 文章
AN - SCOPUS:85112636033
SN - 2331-7019
VL - 16
JO - Physical Review Applied
JF - Physical Review Applied
IS - 1
M1 - 014066
ER -