@inproceedings{5dfbd6074c334125b22e7882d85a2789,
title = "Thin film formation-a fabrication on non-planar surface by spray coating method",
abstract = "This paper presents a three-dimensional micro fabrication and integration technology of smart materials for MEMS by spray coating method. It is shown that SCM is proved most effective in additional deposition on non-planar surface. PZT film is formed both on flat and non-flat surface and its thickness is around 1 μm. Perovskite structure is formed in suitable heat treatment. Ferroelectric P-E hysteresis loop is also obtained. This paper is the first report on deposition of smart materials for MEMS with use of spray coating method from our group and also other researchers. Spray coating method has been proposed for three-dimensional coating method. It is also possible for spray coating method to deposit piezoelectrics, pyroelectrics, magnetics, etc., for sensor and/or actuator after improvement of system construction. Hydrophilic and hydrophobic properties between substrate surface and ejected liquid are most essential process factor of spray coating method in order to improve the film growth condition.",
keywords = "Coatings, Fabrication, Ferroelectric films, Ferroelectric materials, Heat treatment, Magnetic hysteresis, Micromechanical devices, Spraying, Surface treatment, Transistors",
author = "M. Ichiki and Lulu Zhang and Zhen Yang and T. Ikehara and R. Maeda",
note = "Publisher Copyright: {\textcopyright} 2003 IEEE.; 5th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003, DTIP 2003 ; Conference date: 05-05-2003 Through 07-05-2003",
year = "2003",
doi = "10.1109/DTIP.2003.1287057",
language = "英语",
series = "DTIP 2003 - Design, Test, Integration and Packaging of MEMS/MOEMS 2003",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "300--303",
editor = "Bernard Courtois and Karam, \{Jean Michel\} and Jan Korvink and Karen Markus and Keren Bergman and Bernd Michel",
booktitle = "DTIP 2003 - Design, Test, Integration and Packaging of MEMS/MOEMS 2003",
}