TY - GEN
T1 - Thermal simulation of bionic transpiration heat pipe system for high-power LED
AU - Liu, Yongtao
AU - Dong, Kai
AU - Dong, Tao
N1 - Publisher Copyright:
© 2014 Brno University of Technology.
PY - 2014/1/22
Y1 - 2014/1/22
N2 - Light-emitting diodes (LED) has been developing rapidly during recent years due to the advancement of technology driven by the global demand of reducing carbon dioxide emission to the atmosphere. Meanwhile, various kinds of corresponding LED products has been generated and widely used in many fields, e.g.. However, how to improve the luminous efficiency is the challenge in LED industry. And the problem is closely related to PN junction cooling, which becomes more prominent. To solve this problem, a new type of heat dissipation structure is proposed in this paper, which uses a new kind of heat pipe - bionic transpiration heat pipe with high thermal efficiency. In addition, the simulation used ANSYS Icepak on basis of this model will show the advantages of the system we design in details. Furthermore, the application of the present design can further broaden the application fields of LED in IT, military, machinery,aviation and so forth.
AB - Light-emitting diodes (LED) has been developing rapidly during recent years due to the advancement of technology driven by the global demand of reducing carbon dioxide emission to the atmosphere. Meanwhile, various kinds of corresponding LED products has been generated and widely used in many fields, e.g.. However, how to improve the luminous efficiency is the challenge in LED industry. And the problem is closely related to PN junction cooling, which becomes more prominent. To solve this problem, a new type of heat dissipation structure is proposed in this paper, which uses a new kind of heat pipe - bionic transpiration heat pipe with high thermal efficiency. In addition, the simulation used ANSYS Icepak on basis of this model will show the advantages of the system we design in details. Furthermore, the application of the present design can further broaden the application fields of LED in IT, military, machinery,aviation and so forth.
KW - ANSYS Icepak
KW - Bionic Transpiration Heat Pipe
KW - High Power LED
KW - Simulation
UR - https://www.scopus.com/pages/publications/84946693473
U2 - 10.1109/MECHATRONIKA.2014.7018344
DO - 10.1109/MECHATRONIKA.2014.7018344
M3 - 会议稿件
AN - SCOPUS:84946693473
T3 - Proceedings of the 16th International Conference on Mechatronics, Mechatronika 2014
SP - 688
EP - 692
BT - Proceedings of the 16th International Conference on Mechatronics, Mechatronika 2014
A2 - Brezina, Tomas
A2 - Stefek, Alexandr
A2 - Maga, Dusan
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 16th International Conference on Mechatronics, Mechatronika 2014
Y2 - 3 December 2014 through 5 December 2014
ER -