@inproceedings{7d1a48d481574ac2b1f597598b8eff5f,
title = "Thermal performance of microchannels with wavy walls for electronics cooling",
abstract = "Wavy walls are investigated in this paper as a passive scheme to improve the heat transfer performance of low Reynolds number laminar flows in microchannel heat sinks for electronics cooling applications. Three-dimensional laminar fluid flow and heat transfer characteristics in micro-wavy channels are numerically studied for a 500 μm hydraulic diameter channel by varying the wavy feature amplitude at different Reynolds numbers (10, 20, 50 and 100). In addition, flow measurements are made using micro-PIV technique for understanding the fundamentals of fluid flow in the wavy microchannels for the considered Reynolds numbers. Based on the comparison with straight channels, it was found that wavy channels can provide improved heat transfer performance, while keeping the pressure drop within acceptable limits. Accordingly, wavy channels are to found to provide an improvement of up to 26\% in the overall performance compared to microchannels with straight walls and hence are attractive candidates for cooling of future electronics.",
keywords = "Electronics cooling, Heat transfer, Wavy channels, μ-PIV",
author = "Liang Gong and Krishna Kota and Wenquan Tao and Yogendra Joshi",
year = "2010",
doi = "10.1109/ITHERM.2010.5501323",
language = "英语",
isbn = "9781424453429",
series = "2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010",
booktitle = "2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010",
note = "2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010 ; Conference date: 02-06-2010 Through 05-06-2010",
}