Thermal characteristic of a novel flat plate heat pipe for hybrid integrated power electronic module

This paper presents a novel flat heat pipe filled with negative-ion water to take the place of copper heat spreader of commercial power electronic module to solve the issues of heat concentration. With increasing of dissipated power on the die, the heat transfer coefficient on evaporator increases, and then the thermal flux density vector transfers from heat source to the evaporator vertically. In the conditon of 186W/crn² thermal load, the junction-to-case (JC) thermal resistance descreases to the half of commercial power module. The dynamic performance shows that the chip temperature is lower 46°C than that of commercial module using 3 mm copper heat spreader with 225W pulse thermal load and forced air cooling heat sink.