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The thermal-mechanical performance of the uncooled infrared optical-readout bi-material FPA

  • Kong Yan-mei
  • , Liu Rui-wen
  • , Jiao Bin-bin
  • , Lu Di-ke
  • , Zhu En-cheng
  • , Fu Qiang-sheng
  • , Chen Da-peng
  • CAS - Institute of Microelectronics
  • Kunshan MicroOptica Electronic Co. Ltd

科研成果: 期刊稿件 › 文章 › 同行评审

1 引用 (Scopus)

摘要

This paper analyzed the thermal-mechanical performance of the optical-readout bi-material infrared focal array plane (IR-FPA), mainly on the pixel non-uniformity phenomenon. Based on the Fraunhöfer diffraction theory, the model of the initial angle inconformity among the pixels due to the processing bias was presented, the result shows that the initial angle tolerance of pixels must be kept within 0.358° for the 49.5 × 49.5 μm2 pixel. The intensity of the image corresponding to different reflect angles of pixels was tested using the 360° horizontal rotary micro displacement stage driven by stepped motor. And the result agrees with the theoretical calculation. Furthermore, the thermal-mechanic sensitivity ST and dynamic range of the object temperature (blackbody) was also computed, which affords new reference for the research and manufacture of the optical read-out IR-FPA process.

源语言英语
页(从-至)1495-1500
页数6
期刊Microsystem Technologies
卷21
期7
DOI
出版状态已出版 - 11 7月 2015
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