TY - GEN
T1 - The Reliability of Press-pack IGBT in MMC Based on Electro-Thermo-Mechanical Simulation
AU - Guo, Weili
AU - Liu, Zhi
AU - Ma, Dingkun
AU - Wang, Laili
N1 - Publisher Copyright:
© 2020 IEEE.
PY - 2020/11/23
Y1 - 2020/11/23
N2 - Press-pack IGBTs are now widely used in HVDC and FACTS since its extraordinary reliability and high power density. A method to estimate the reliability of press-pack IGBT based on FEM is proposed. A circuit model of MMC was simulated by Simplorer in order to obtain the power loss model of press-pack IGBT. The coupled steady-state simulation of thermal, electrical and mechanical model was analyzed by Workbench. Furthermore, the transient junction swing of IGBT was estimated by a power loss with half sine profile. LESIT lifetime prediction model was used to analyze the lifetime and reliability of press-pack IGBT in MMC system. Press-pack IGBT has high reliability in MMC in long time scale since the low junction temperature of it.
AB - Press-pack IGBTs are now widely used in HVDC and FACTS since its extraordinary reliability and high power density. A method to estimate the reliability of press-pack IGBT based on FEM is proposed. A circuit model of MMC was simulated by Simplorer in order to obtain the power loss model of press-pack IGBT. The coupled steady-state simulation of thermal, electrical and mechanical model was analyzed by Workbench. Furthermore, the transient junction swing of IGBT was estimated by a power loss with half sine profile. LESIT lifetime prediction model was used to analyze the lifetime and reliability of press-pack IGBT in MMC system. Press-pack IGBT has high reliability in MMC in long time scale since the low junction temperature of it.
UR - https://www.scopus.com/pages/publications/85099787546
U2 - 10.1109/SSLChinaIFWS51786.2020.9308685
DO - 10.1109/SSLChinaIFWS51786.2020.9308685
M3 - 会议稿件
AN - SCOPUS:85099787546
T3 - 2020 17th China International Forum on Solid State Lighting and 2020 International Forum on Wide Bandgap Semiconductors China, SSLChina: IFWS 2020
SP - 266
EP - 270
BT - 2020 17th China International Forum on Solid State Lighting and 2020 International Forum on Wide Bandgap Semiconductors China, SSLChina
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 17th China International Forum on Solid State Lighting and 2020 International Forum on Wide Bandgap Semiconductors China, SSLChina: IFWS 2020
Y2 - 23 November 2020 through 25 November 2020
ER -