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Templateless, Plating-Free Fabrication of Flexible Transparent Electrodes with Embedded Silver Mesh by Electric-Field-Driven Microscale 3D Printing and Hybrid Hot Embossing

  • Xiaoyang Zhu
  • , Mingyang Liu
  • , Ximeng Qi
  • , Hongke Li
  • , Yuan Fang Zhang
  • , Zhenghao Li
  • , Zilong Peng
  • , Jianjun Yang
  • , Lei Qian
  • , Quan Xu
  • , Nairui Gou
  • , Jiankang He
  • , Dichen Li
  • , Hongbo Lan
  • Qingdao University of Technology
  • Singapore University of Technology and Design
  • Ohio State University
  • Hong Kong Polytechnic University

科研成果: 期刊稿件文章同行评审

197 引用 (Scopus)

摘要

Flexible transparent electrodes (FTEs) with an embedded metal mesh are considered a promising alternative to traditional indium tin oxide (ITO) due to their excellent photoelectric performance, surface roughness, and mechanical and environmental stability. However, great challenges remain for achieving simple, cost-effective, and environmentally friendly manufacturing of high-performance FTEs with embedded metal mesh. Herein, a maskless, templateless, and plating-free fabrication technique is proposed for FTEs with embedded silver mesh by combining an electric-field-driven (EFD) microscale 3D printing technique and a newly developed hybrid hot-embossing process. The final fabricated FTE exhibits superior optoelectronic properties with a transmittance of 85.79%, a sheet resistance of 0.75 Ω sq−1, a smooth surface of silver mesh (Ra ≈ 18.8 nm) without any polishing treatment, and remarkable mechanical stability and environmental adaptability with a negligible increase in sheet resistance under diverse cyclic tests and harsh working conditions (1000 bending cycles, 80 adhesion tests, 120 scratch tests, 100 min ultrasonic test, and 72 h chemical attack). The practical viability of this FTE is successfully demonstrated with a flexible transparent heater applied to deicing. The technique proposed offers a promising fabrication strategy with a cost-effective and environmentally friendly process for high-performance FTE.

源语言英语
文章编号2007772
期刊Advanced Materials
33
21
DOI
出版状态已出版 - 27 5月 2021

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