摘要
Tungsten thin films with different thicknesses were deposited on Si substrate and Mo seed-layer by magnetron sputtering. X-ray diffraction (XRD) analyses and field emission scanning electronic microscopy (FESEM) observations show that stable α-W in equiaxial-grain shape is preferred on Mo layer driven by template effect while the metastable β-W with non-equiaxed grain structure appears to form on silicon substrate. Additionally, residual stress and electronic resistivity depend upon the film thickness considerably, but with different mechanisms. For the case of β-W, electronic resistivity and residual tensile stress increase with decreasing film thickness indeed because of reduced grain size. Whereas, for α-W case, at film thicknesses equal to or smaller than tens of nanometers, the constraint of coherent interface between α-W and Mo will dominate and enhance the resistivity and residual compressive stress.
| 源语言 | 英语 |
|---|---|
| 页(从-至) | 99-104 |
| 页数 | 6 |
| 期刊 | Materials Science and Engineering: B |
| 卷 | 139 |
| 期 | 1 |
| DOI | |
| 出版状态 | 已出版 - 25 4月 2007 |
学术指纹
探究 'Template-induced formation of α-W and size-dependent properties of tungsten thin films' 的科研主题。它们共同构成独一无二的学术指纹。引用此
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