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Structure Optimization Analysis of MEMS Microphone Packaging Shell

  • Jiazhu Li
  • , Shiwang Zhang
  • , Shaohui Qin
  • , Jiawei Yuan
  • , Zixuan Li
  • , Zheng Yuan
  • , Zilong Zhao
  • , Ruiyan Luo
  • , Hongqiang Tan
  • , Yihe Zhao
  • , Jie Lif
  • , Wendi Gao
  • , Zhikang Li
  • , Libo Zhao
  • Xi'an Jiaotong University
  • Shaanxi University of Science and Technology
  • Shandong Laboratory of Yantai Advanced Materials and Green Manufacturing

科研成果: 书/报告/会议事项章节会议稿件同行评审

摘要

Due to compact size, high consistency, and resistance to radio frequency interference, MEMS microphones are increasingly important in the consumer electronics market and have driven the development of intelligent applications. There is a growing demand for enhanced performance in MEMS microphones. Currently, research on the shell design of MEMS microphones is relatively shallow, often only considering the accommodation of the vibrating diaphragm and ASIC chip, as well as the minimization of volume, without focusing on the impact of the shell configuration on the microphone's acoustic performance. Therefore, this paper starts from the perspective of optimizing acoustic response and studies the impact of the packaging shell configuration and design parameters of MEMS microphones on the microphone's sensitivity and frequency response, including the sound collection hole diameter, chamber volume, and chip layout. The goal is to establish a quantitative relationship between these key parameters and the microphone's performance. Simulation software was used to simulate the acoustic characteristics of the microphone shell, and optimal design parameters were recommended based on the simulation results. In addition, the research also proposes methods to adjust the frequency response of the microphone within the target frequency range, providing a reference direction for the scientific design of the shell structure to reduce the transmission loss of acoustic energy and enhance response sensitivity.

源语言英语
主期刊名Third International Conference on New Materials, Machinery, and Vehicle Engineering, NMMVE 2024
编辑Jinyang Xu, J. Paulo Davim
出版商SPIE
ISBN(电子版)9781510686267
DOI
出版状态已出版 - 2024
活动3rd International Conference on New Materials, Machinery, and Vehicle Engineering, NMMVE 2024 - Dalian, 中国
期限: 19 7月 202421 7月 2024

出版系列

姓名Proceedings of SPIE - The International Society for Optical Engineering
13420
ISSN(印刷版)0277-786X
ISSN(电子版)1996-756X

会议

会议3rd International Conference on New Materials, Machinery, and Vehicle Engineering, NMMVE 2024
国家/地区中国
Dalian
时期19/07/2421/07/24

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