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Silane modified Cr2O3/polyimide nanocomposite films with excellent surface insulation performance for space applications

  • Wenrui Li
  • , Xiong Yang
  • , Changchun Qi
  • , Yucheng Zhang
  • , Yibo Dong
  • , Xin Zhao
  • , Zhiliang Gao
  • , Na Feng
  • , Baipeng Song
  • , Guan Jun Zhang
  • Xi'an Jiaotong University
  • Beijing Orient Institute of Measurement and Test

科研成果: 期刊稿件文章同行评审

9 引用 (Scopus)

摘要

The exploration of deep space significantly increases the probability of spacecraft failures due to surface electrostatic discharge, which imposes higher vacuum insulation protection requirements on polyimide (PI), the external insulation material of spacecrafts. To address this challenge, this study proposes using silane coupling agent KH550 for organic grafting treatment of Cr2O3 nanoparticles, which are then used to dope and modify PI to enhance the vacuum surface insulation of PI films. The KH550 grafting improves the interface strength between the fillers and the matrix, allowing the fillers to be uniformly dispersed in the matrix. Compared to pure PI films, the prepared PI-Cr2O3@KH550 composite films exhibit significantly enhanced vacuum surface flashover voltage, improved surface/volume resistivity, and dielectric properties. The results demonstrate that PI composite films with 0.8% by mass of Cr2O3@KH550 show the most notable performance improvement, with the DC flashover voltage and impulse flashover voltage in vacuum increasing by 20.7% and 27.8%, respectively. The doping of chromium oxide nanoparticles introduces more deep traps into the PI films and reduce the surface resistivity. The higher deep trap density inhibits charge migration, thereby alleviating secondary electron emission and surface electric field distortion. Simultaneously, the lower surface resistivity facilitates dissipating surface charges and improves the surface insulation. These findings are of significant reference value for promoting the enhancement of aerospace insulation performance.

源语言英语
文章编号475706
期刊Nanotechnology
35
47
DOI
出版状态已出版 - 18 11月 2024

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