@inproceedings{7ad31f080275434ba755e7093d01127f,
title = "Room temperature bonding of GaN on diamond by using Mo/Au nano-adhesion layer",
abstract = "For solving the heat dissipation of high-power GaN devices, GaN was bonded on diamond at room temperature by using Mo/Au nano-adhesion layer. For a bonded GaN-on-diamond sample, the voidage is less than 3.0\%, and the tensile strength reaches 6.8 MPa.",
author = "Kang Wang and Kun Ruan and Hu, \{Wen Bo\} and Wu, \{Sheng Li\} and Wang, \{Hong Xing\}",
note = "Publisher Copyright: {\textcopyright} 2019 JSPS 191st Committee on Innovative Interface Bonding Technology.; 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019 ; Conference date: 21-05-2019 Through 25-05-2019",
year = "2019",
month = may,
doi = "10.23919/LTB-3D.2019.8735406",
language = "英语",
series = "Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "22",
booktitle = "Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019",
}