Residual stresses in monolithic multi-sensor package

To investigate the sensor packaging effect, the finite element method is adopted for analyzing the distribution of residual stress in the multi-sensor chip with FR4 substrates. The variability of the residual stress is investigated by changing the adhesive with different Young's modulus, the thickness and fillet height parameters. The experiment of the monolithic multi-sensor package is performed. The simulated results are compared with the experimental ones. The results show that the package-induced residual stress can be reduced by decreasing the Young's modulus of the adhesive, increasing the thickness and fillet height of the adhesive.