Research on packaging technology of high temperature pressure transducer

Three advanced packaging methods which could stand high temperature up to 200°C were raised to package some pressure transducers with special structure. By stimulating using finite element method, we decided to take low temperature glass frits bonding technology to package pressure transducers and determined the appropriate thickness of the intermedia bonding layer. We chose a alloy substrate material with high strength and low expansion coefficient and designed the technological process of low temperature glass frits bonding, using advanced screen printing technology to ensure the intermediate bonding layer thickness. Experiments show that by the packaging process, pressure transducers have reliable performance in high temperature and can meet the needs of modern industrial measurements.