Rectangular grooves suppressing multipactor across high power microwave dielectric window

Dielectric window is an important component of high power microwave (HPM) generation device. However, breakdown easily occurs on vacuum/dielectric interface with the development of HPM device. Surface breakdown limits the generation and transmission of HPM, and becomes the bottle neck of HPM technology development. For further understanding the breakdown mechanism and improving the threshold, the theoretical and experimental investigation of multipactor suppressed in rectangular grooves simulation model is built in this paper. From the dynamic analysis and PIC simulation, the movement of multipactor electron in grooves is obtained and the physical process of rectangular grooves suppression breakdown is simulated. Breakdown experiments of polytetrafluoroethylene (PTFE) under an S-band (2.86 GHz) HPM are conducted, and the obtained results correspond to the suppression theory.