Properties of plt thin films by thermal decomposition of metalloorganic compounds

Wei Ren; Yun Liu; Jihui Qiu; Liangying Zhang; Xi Yao

doi:10.1080/00150199408017620

Properties of plt thin films by thermal decomposition of metalloorganic compounds

Wei Ren
, Yun Liu
, Jihui Qiu
, Liangying Zhang
, Xi Yao

电子与信息学部

Xi'an Jiaotong University

科研成果: 期刊稿件 › 文章 › 同行评审

16 引用（Scopus）

摘要

The PLT thin films on silicon substrate were prepared by MOD method. The relationship of dielectric constants and loss tangent with annealing temperatures and La content were investigated. Curie temperatures of PLT films decrease linearly at a rate of -17°C/mol% with increasing of La content. Ps, Pr and Ec of the films were studied by P-E hysteresis loops. Large Pr value of 19.61nC/cm2 has been achieved in PLT5 films, while Ec is 164KV/cm, which is much higher than that of bulk materials.

源语言	英语
页（从-至）	201-206
页数	6
期刊	Ferroelectrics
卷	152
期	1
DOI	https://doi.org/10.1080/00150199408017620
出版状态	已出版 - 2月 1994

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abstract = "The PLT thin films on silicon substrate were prepared by MOD method. The relationship of dielectric constants and loss tangent with annealing temperatures and La content were investigated. Curie temperatures of PLT films decrease linearly at a rate of -17°C/mol\% with increasing of La content. Ps, Pr and Ec of the films were studied by P-E hysteresis loops. Large Pr value of 19.61nC/cm2 has been achieved in PLT5 films, while Ec is 164KV/cm, which is much higher than that of bulk materials.",

author = "Wei Ren and Yun Liu and Jihui Qiu and Liangying Zhang and Xi Yao",

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AB - The PLT thin films on silicon substrate were prepared by MOD method. The relationship of dielectric constants and loss tangent with annealing temperatures and La content were investigated. Curie temperatures of PLT films decrease linearly at a rate of -17°C/mol% with increasing of La content. Ps, Pr and Ec of the films were studied by P-E hysteresis loops. Large Pr value of 19.61nC/cm2 has been achieved in PLT5 films, while Ec is 164KV/cm, which is much higher than that of bulk materials.

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Properties of plt thin films by thermal decomposition of metalloorganic compounds

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