TY - GEN
T1 - Preparation and modification of soluble bismaleimide oligopolymer
AU - Chen, Yu Fei
AU - Teng, Cheng Jun
AU - Zhang, De Zhong
AU - Liu, Wei
AU - Fan, Yong
AU - Lei, Qing Quan
PY - 2006
Y1 - 2006
N2 - Bismaleimide oligopolymer resins have been widely used as insulating material, due to its outstanding mechanical properties, higher thermal stability. However, it has some shortcomings that the melt body viscosity is too heavy and toughness is poor. This article describes the preparation of soluble bismaleimide oligopolymer by chemical imidization method - 3,3′-diethyl-4, 4′-diamino diphenyl methane(DEDADPM),pyromellitic anhydride (PMDA) and maleic anhydride (MA),with the organic solvent (N,N′-dimethyl acetamide) in the room temperature. The mole propotion of DEDADPM, PMDA and MA is 10 9 2.And, unsaturated polyester and cross-linking agent diallyl phthalate (DAP)is used to modificate this system, its some of properties are improved. The result of FR-IR demonstrated that imide ring has already been formed. Heat decomposition temperature (Td) is 400 500.The tensile strength (10%DAP) is 106Mpa. This system can be used as a premium grade matrix resin of composite material.
AB - Bismaleimide oligopolymer resins have been widely used as insulating material, due to its outstanding mechanical properties, higher thermal stability. However, it has some shortcomings that the melt body viscosity is too heavy and toughness is poor. This article describes the preparation of soluble bismaleimide oligopolymer by chemical imidization method - 3,3′-diethyl-4, 4′-diamino diphenyl methane(DEDADPM),pyromellitic anhydride (PMDA) and maleic anhydride (MA),with the organic solvent (N,N′-dimethyl acetamide) in the room temperature. The mole propotion of DEDADPM, PMDA and MA is 10 9 2.And, unsaturated polyester and cross-linking agent diallyl phthalate (DAP)is used to modificate this system, its some of properties are improved. The result of FR-IR demonstrated that imide ring has already been formed. Heat decomposition temperature (Td) is 400 500.The tensile strength (10%DAP) is 106Mpa. This system can be used as a premium grade matrix resin of composite material.
UR - https://www.scopus.com/pages/publications/43649086536
U2 - 10.1109/ICPADM.2006.284217
DO - 10.1109/ICPADM.2006.284217
M3 - 会议稿件
AN - SCOPUS:43649086536
SN - 1424401895
SN - 9781424401895
T3 - Proceedings of the IEEE International Conference on Properties and Applications of Dielectric Materials
SP - 472
EP - 475
BT - Proceedings of ICPADM 2006 - 8th International Conference on Properties and Applications of Dielectric Materials
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - ICPADM 2006 - 8th International Conference on Properties and Applications of Dielectric Materials
Y2 - 26 June 2006 through 30 June 2006
ER -