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Pool boiling enhancement through cylindrical confined space over open rectangular microchannels

  • Yifang Dong
  • , Adnan Ibrahim
  • , Ruihai Su
  • , Binbin Jiao
  • , Xuegong Hu
  • CAS - Institute of Microelectronics
  • University of Science and Technology of China
  • CAS - Institute of Engineering Thermophysics
  • University of Chinese Academy of Sciences

科研成果: 期刊稿件文章同行评审

9 引用 (Scopus)

摘要

Boiling is an effective heat transfer method that uses the latent heat of phase change to dissipate a high heat flux at a small temperature difference. It has many applications in the fields of energy and engineering. Among the multitudinous enhanced boiling technologies, several studies have focused on microchannel-enhanced surfaces; however, those on cylindrical confined spaces are scarce. In this study, cylindrical confined spaces were constructed using several hollow cylinders with heights of 1, 3, 5, and 7 mm, and a 1 mm gap between the cylindrical wall and the heating surface. The effects of various cylindrical confined space heights on the characteristics of pool boiling heat transfer were investigated. Consequently, pool boiling heat transfer was substantially enhanced by the cylindrical confined space in comparison to the plane copper, and improved as the height of the confined space increased. The combined effects of the cylindrical confined space and liquid-height confinement were explored for a cylindrical confined space of 3 mm. Mushroom bubbles with various cylindrical confined space heights were observed at a liquid height of 50 mm. The vapor-jet phenomenon became more pronounced as the height of the cylindrically confined space increased. Furthermore, a predictive correlation among the open rectangular microchannels, liquid levels, and cylindrical confined spaces for the pool boiling heat transfer coefficient was established, which could predict more than 96.7 % of the experimental data within an acceptable error range of ±30 %.

源语言英语
文章编号108576
期刊International Communications in Heat and Mass Transfer
162
DOI
出版状态已出版 - 3月 2025
已对外发布

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