TY - GEN
T1 - Polymer MOEMS mirror by all vacuum-less processes combining printed film and injection molding replication
AU - Kurihara, Kazuma
AU - Takagi, Hideki
AU - Maeda, Ryutaro
PY - 2012
Y1 - 2012
N2 - A MOEMS mirror device was fabricated by only replication process and transfer of screen printed-MEMS functional layer from a PET film. The polymer-MEMS device consists with a mirror surface, a magnetic ink and a strain gauge sensor. Using the thick membrane for the mirror part, the deformation of the mirror surface was kept to optical flat. In contrast, the thin membrane of the spring part could allow large tilt angle in low-magnetic force. The tilt angle was evaluated to be 30 degree when the magnetic force was operated to be 55 gauss. In addition, by detecting the strain sensor signal, the actuated frequency of the polymer-mirror device was controlled to resonance condition. We consider that the developed process has a potential to attain a MEMS device production in a low-cost and a high-throughput under all-vacuumless atmosphere.
AB - A MOEMS mirror device was fabricated by only replication process and transfer of screen printed-MEMS functional layer from a PET film. The polymer-MEMS device consists with a mirror surface, a magnetic ink and a strain gauge sensor. Using the thick membrane for the mirror part, the deformation of the mirror surface was kept to optical flat. In contrast, the thin membrane of the spring part could allow large tilt angle in low-magnetic force. The tilt angle was evaluated to be 30 degree when the magnetic force was operated to be 55 gauss. In addition, by detecting the strain sensor signal, the actuated frequency of the polymer-mirror device was controlled to resonance condition. We consider that the developed process has a potential to attain a MEMS device production in a low-cost and a high-throughput under all-vacuumless atmosphere.
UR - https://www.scopus.com/pages/publications/84864694937
M3 - 会议稿件
AN - SCOPUS:84864694937
SN - 9781467307857
T3 - DTIP 2012 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
SP - 200
EP - 203
BT - DTIP 2012 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
T2 - 2012 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2012
Y2 - 25 April 2012 through 27 April 2012
ER -