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Overcoming high-temperature performance limitations: Multidimensional design and innovation of thin-film thermocouples

  • Zhongkai Zhang
  • , Tianci Zhang
  • , Zhaojun Liu
  • , Meng Wang
  • , Guoliang Zhou
  • , Xiang Liu
  • , Chen Wu
  • , Xudong Fang
  • , Duanzhi Duan
  • , Bian Tian
  • Xi'an Jiaotong University

科研成果: 期刊稿件文献综述同行评审

摘要

Thin-film thermocouples (TFTCs) are known for their thinness, low thermal mass, fast response time, and low interference with component structure and flow field. High-temperature sensors have become an essential technological area for high-temperature tests of advanced equipment such as aeroengines and hypersonic vehicles. This paper presents a systematic review of research advancements in high-temperature thin-film thermocouples (HT-TFTCs) across five core dimensions: material systems, structural design, fabrication processes, failure mechanisms and protection, and self-healing technologies. In addition, this paper outlines future development trends. In order to enhance the development of HT-TFTCs with long service life and high reliability, as well as intelligent applications, it is necessary to strengthen multi-dimensional collaborative design and integrated innovation, further promote self-healing technology with intelligent regeneration, and overcome performance limitations.

源语言英语
文章编号116209
期刊iScience
29
6
DOI
出版状态已出版 - 19 6月 2026

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