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On the heat transfer at the interface between a solidifying metal and a solid substrate

  • G. X. Wang
  • , E. F. Matthys

科研成果: 书/报告/会议事项章节会议稿件同行评审

15 引用 (Scopus)

摘要

The interfacial thermal conductance ('h') between a solidifying molten metal layer and a cold solid substrate is a critical parameter for many material processing and manufacturing applications such as continuous slab casting, strip casting, melt-spinning, spray deposition and others. Relatively few comprehensive data on the interfacial thermal conductance for such applications are available, however. In this article we tabulate and review most of the data available in the literature for these processes. Some strong correlations between the estimated values for h and the casting speed or strip thickness are seen to hold over surprisingly wide ranges of parameters. We also discuss some of our recent experimental results showing the effect of various process parameters such as superheat, roughness, and material properties, on the interfacial conductance. The results also quantify the significant variations that this parameter undergoes as the liquid/solid interface becomes a solid/solid interface.

源语言英语
主期刊名Melt Spinning, Strip Casting and Slab Casting
编辑Ray Y. Lin, Y.Austin Chang, Ramana G. Reddy, C.T. Liu
205-236
页数32
出版状态已出版 - 1995
活动Proceedings of the 1996 125th TMS Annual Meeting - Anaheim, CA, USA
期限: 4 2月 19968 2月 1996

出版系列

姓名TMS Annual Meeting

会议

会议Proceedings of the 1996 125th TMS Annual Meeting
Anaheim, CA, USA
时期4/02/968/02/96

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