TY - GEN
T1 - Oil-filled isolated high pressure sensor for high temperature application
AU - Jiang, Zhuangde
AU - Zhao, Libo
AU - Zhao, Yulong
AU - Liu, Yuanhao
AU - Prewett, Philip D.
AU - Jiang, Kyle
PY - 2010
Y1 - 2010
N2 - In order to solve pressure measurement problems in the fields of aerospace, petroleum and chemical industry, mobile and military industry, a oil-filled isolated piezoresistive high pressure sensor has been developed with the range of 0∼100 MPa, and was able to work reliably under high temperature of above 200 °C. Based on MEMS (Micro Electro-Mechanical System) and SIMOX (Separation by Implantation of Oxygen) technology, the piezoresistive sensor chip has been developed. By high temperature packaging process, the oil-filled isolated high pressure sensor was fabricated with the sensor chip and corrugated diaphragm. The experimental results showed that the oil-filled isolated high pressure sensor had good performances under high temperature of 200 °C, such as linearity error of 0.07%FS, repeatability error of 0.04%FS, hysteresis error of 0.03%FS.
AB - In order to solve pressure measurement problems in the fields of aerospace, petroleum and chemical industry, mobile and military industry, a oil-filled isolated piezoresistive high pressure sensor has been developed with the range of 0∼100 MPa, and was able to work reliably under high temperature of above 200 °C. Based on MEMS (Micro Electro-Mechanical System) and SIMOX (Separation by Implantation of Oxygen) technology, the piezoresistive sensor chip has been developed. By high temperature packaging process, the oil-filled isolated high pressure sensor was fabricated with the sensor chip and corrugated diaphragm. The experimental results showed that the oil-filled isolated high pressure sensor had good performances under high temperature of 200 °C, such as linearity error of 0.07%FS, repeatability error of 0.04%FS, hysteresis error of 0.03%FS.
KW - Chip
KW - Corrugated diaphragm
KW - High pressure sensor
KW - High temperature
KW - Oil-filled
UR - https://www.scopus.com/pages/publications/77955530414
U2 - 10.4028/www.scientific.net/KEM.437.397
DO - 10.4028/www.scientific.net/KEM.437.397
M3 - 会议稿件
AN - SCOPUS:77955530414
SN - 0878492739
SN - 9780878492732
T3 - Key Engineering Materials
SP - 397
EP - 401
BT - Measurement Technology and Intelligent Instruments IX
PB - Trans Tech Publications Ltd
T2 - 9th International Symposium on Measurement Technology and Intelligent Instruments, ISMTII-2009
Y2 - 29 June 2009 through 2 July 2009
ER -