TY - JOUR
T1 - Multi-objective parameter optimization design of tapered-type manifold/variable cross-section microchannel heat sink
AU - Li, Jin Bo
AU - Zhang, Tian Yi
AU - Li, Zheng Dao
AU - Chen, Lei
AU - Tao, Wen Quan
N1 - Publisher Copyright:
© 2024 Elsevier Ltd
PY - 2024/8/15
Y1 - 2024/8/15
N2 - Manifold microchannel heat sinks (MMCHS) have been widely used in the thermal management of high heat flux electronic devices. To improve the temperature uniformity of MMCHS and reduce the hot spot temperature, a tapered-type manifold/variable cross-section microchannel heat sink (TMVC-MCHS) is proposed in this study. Key parameters affecting the heat transfer performance of TMVC-MCHS were first investigated numerically. The results indicate that the width inclination ratio (αw,in) of the inlet manifold has a greater influence on the coolant flow distribution than the height inclination ratio (αh,in), with a ratio of more than 2.5. In addition, the microchannel inclination (β) and width ratio (ε) affect significantly the fluid flow and heat transfer. To further improve the cooling effect of the heat sink, this study adopted XGBoost and multi-objective genetic algorithm (NSGA-II) to optimize the structure. The maximum temperature of the substrate (Tmax) and the total pressure drop (ΔP) are the optimization objectives. Besides, the compromise solution (αw,in = 0.40, β = 0.63 and ε = 0.52) was determined by TOPSIS combined with the entropy weight method which was validated by the CFD method with an error margin of only 3 %. Finally, Compared to MMCHS, the temperature field distribution uniformity of TMVC-MCHS is significantly improved. The maximum bottom surface temperature is drastically reduced from 337.79 K to 320.01 K, and the temperature difference is reduced from 17.5 K to 3.5 K, at the cost of only a 3.5 kPa pressure rise. For inlet flow rates ranging from 1 m/s to 2.5 m/s, the TMVC-MCHS exhibits a hydrothermal performance factor (PEC) improvement of over 35 %, indicating superior comprehensive performance.
AB - Manifold microchannel heat sinks (MMCHS) have been widely used in the thermal management of high heat flux electronic devices. To improve the temperature uniformity of MMCHS and reduce the hot spot temperature, a tapered-type manifold/variable cross-section microchannel heat sink (TMVC-MCHS) is proposed in this study. Key parameters affecting the heat transfer performance of TMVC-MCHS were first investigated numerically. The results indicate that the width inclination ratio (αw,in) of the inlet manifold has a greater influence on the coolant flow distribution than the height inclination ratio (αh,in), with a ratio of more than 2.5. In addition, the microchannel inclination (β) and width ratio (ε) affect significantly the fluid flow and heat transfer. To further improve the cooling effect of the heat sink, this study adopted XGBoost and multi-objective genetic algorithm (NSGA-II) to optimize the structure. The maximum temperature of the substrate (Tmax) and the total pressure drop (ΔP) are the optimization objectives. Besides, the compromise solution (αw,in = 0.40, β = 0.63 and ε = 0.52) was determined by TOPSIS combined with the entropy weight method which was validated by the CFD method with an error margin of only 3 %. Finally, Compared to MMCHS, the temperature field distribution uniformity of TMVC-MCHS is significantly improved. The maximum bottom surface temperature is drastically reduced from 337.79 K to 320.01 K, and the temperature difference is reduced from 17.5 K to 3.5 K, at the cost of only a 3.5 kPa pressure rise. For inlet flow rates ranging from 1 m/s to 2.5 m/s, the TMVC-MCHS exhibits a hydrothermal performance factor (PEC) improvement of over 35 %, indicating superior comprehensive performance.
KW - Jet impingement
KW - Multi-objective optimization
KW - Temperature uniformity
KW - XGBoost
UR - https://www.scopus.com/pages/publications/85195395468
U2 - 10.1016/j.applthermaleng.2024.123587
DO - 10.1016/j.applthermaleng.2024.123587
M3 - 文章
AN - SCOPUS:85195395468
SN - 1359-4311
VL - 251
JO - Applied Thermal Engineering
JF - Applied Thermal Engineering
M1 - 123587
ER -