TY - GEN
T1 - Molecular dynamics simulation of explosive boiling on concave nanostructured surface
AU - Ji, Pengfei
AU - He, Mengzhe
AU - Rong, Yiming
AU - Zhang, Yuwen
AU - Tang, Yong
N1 - Publisher Copyright:
Copyright © 2018 ASME.
PY - 2018
Y1 - 2018
N2 - Explosive boiling occurs when a liquid film contacts with the wall at extremely high temperature, which is detrimental to continuous heat transfer process. In this paper, five kinds of nanostructured surfaces with equal distance between neighboring nano-concaves and flat surface are set up to study the explosive boiling of liquid argon on copper surface. For all the five cases with concave nanostructured surface, the ratio of concave nanostructured surface area to flat surface area is kept as a constant. The temporal and spatial distributions of temperature, atomic motion and number density are recorded to study the effects of different nanostructured surface designs on explosive boiling. From the perspective of reducing explosive boiling, the most favorable nanostructured surface is determined.
AB - Explosive boiling occurs when a liquid film contacts with the wall at extremely high temperature, which is detrimental to continuous heat transfer process. In this paper, five kinds of nanostructured surfaces with equal distance between neighboring nano-concaves and flat surface are set up to study the explosive boiling of liquid argon on copper surface. For all the five cases with concave nanostructured surface, the ratio of concave nanostructured surface area to flat surface area is kept as a constant. The temporal and spatial distributions of temperature, atomic motion and number density are recorded to study the effects of different nanostructured surface designs on explosive boiling. From the perspective of reducing explosive boiling, the most favorable nanostructured surface is determined.
KW - Explosive boiling
KW - Nanostructured surface
KW - Superheating
UR - https://www.scopus.com/pages/publications/85063137662
U2 - 10.1115/IMECE2018-86965
DO - 10.1115/IMECE2018-86965
M3 - 会议稿件
AN - SCOPUS:85063137662
T3 - ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)
BT - Heat Transfer and Thermal Engineering
PB - American Society of Mechanical Engineers (ASME)
T2 - ASME 2018 International Mechanical Engineering Congress and Exposition, IMECE 2018
Y2 - 9 November 2018 through 15 November 2018
ER -