摘要
The mechanics of film-on-foil devices is presented in the context of thin-film transistors on steel and plastic foils. Provided the substrates are thin, such transistors function well after the foils are rolled to small radii of curvature. When a substrate with a lower elastic modulus is used, smaller radii of curvature can be achieved. Furthermore, when the transistors are placed in the neutral surface by sandwiching between a substrate and an encapsulation layer, even smaller radii of curvature can be attained. Transistor failure clearly shows when externally forced and thermally induced strains add to, or subtract from, each other.
| 源语言 | 英语 |
|---|---|
| 页(从-至) | 1177-1179 |
| 页数 | 3 |
| 期刊 | Applied Physics Letters |
| 卷 | 74 |
| 期 | 8 |
| DOI | |
| 出版状态 | 已出版 - 1999 |
| 已对外发布 | 是 |
学术指纹
探究 'Mechanics of rollable and foldable film-on-foil electronics' 的科研主题。它们共同构成独一无二的学术指纹。引用此
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