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Mechanics of rollable and foldable film-on-foil electronics

  • Z. Suo
  • , E. Y. Ma
  • , H. Gleskova
  • , S. Wagner
  • Princeton University

科研成果: 期刊稿件文章同行评审

701 引用 (Scopus)

摘要

The mechanics of film-on-foil devices is presented in the context of thin-film transistors on steel and plastic foils. Provided the substrates are thin, such transistors function well after the foils are rolled to small radii of curvature. When a substrate with a lower elastic modulus is used, smaller radii of curvature can be achieved. Furthermore, when the transistors are placed in the neutral surface by sandwiching between a substrate and an encapsulation layer, even smaller radii of curvature can be attained. Transistor failure clearly shows when externally forced and thermally induced strains add to, or subtract from, each other.

源语言英语
页(从-至)1177-1179
页数3
期刊Applied Physics Letters
74
8
DOI
出版状态已出版 - 1999
已对外发布

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