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Measurement study of residual stress on tungsten-rhenium thin film thermocouples by nanoindentation technology

  • Xi'an Jiaotong University

科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审

5 引用 (Scopus)

摘要

In this paper, Nano-indentation technology is used to test the mechanical property of the tungsten-rhenium thin film, including hardness, elastic modulus and residual stress. The effects of different heat treatment temperature and different substrates on the hardness and elastic modulus of tungsten-rhenium films were studied. We research three substrates which are silicon carbide ceramic, aluminum oxide ceramic and zirconium oxide ceramic. Test results show that the tungsten-rhenium films on aluminum oxide ceramic shows the biggest values of elastic modulus and the smallest on silicon carbide ceramic. However, value of hardness is biggest on zirconium oxide ceramic and smallest on aluminum oxide ceramic. Besides, the heat treatment temperature has high influence on hardness and elastic modulus of tungsten-rhenium film. And under different substrates, the hardness and elastic modulus of film on zirconium oxide ceramic is the most sensitive to heat treatment temperature. By contrast, silicon carbide ceramic is the least.

源语言英语
主期刊名2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017
出版商Institute of Electrical and Electronics Engineers Inc.
页800-803
页数4
ISBN(电子版)9781509030590
DOI
出版状态已出版 - 25 8月 2017
活动12th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017 - Los Angeles, 美国
期限: 9 4月 2017 → 12 4月 2017

丛书

姓名2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017

会议

会议12th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017
国家/地区美国
市Los Angeles
时期9/04/17 → 12/04/17

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