Materials Science Forum - Advanced Welding and Micro Joining/Packaging for the 21st Century - Selected peer reviewed papers from the International Welding/Joining Conference-Korea 2007, IWJC 2007: Preface

Dong Hwan Park; Suck Joo Na

Materials Science Forum - Advanced Welding and Micro Joining/Packaging for the 21st Century - Selected peer reviewed papers from the International Welding/Joining Conference-Korea 2007, IWJC 2007: Preface

Dong Hwan Park
, Suck Joo Na

材料科学与工程学院

Korean Welding and Joining Society

科研成果: 期刊稿件 › 社论

源语言	英语
页（从-至）	v
期刊	Materials Science Forum
卷	580-582
出版状态	已出版 - 2008
活动	International Welding/Joining Conference-Korea 2007, IWJC 2007 - Seoul, 韩国期限: 10 5月 2007 → 12 5月 2007

其它文件与链接

链接到 Scopus 的出版物

引用此

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title = "Materials Science Forum - Advanced Welding and Micro Joining/Packaging for the 21st Century - Selected peer reviewed papers from the International Welding/Joining Conference-Korea 2007, IWJC 2007: Preface",

author = "Park, \{Dong Hwan\} and Na, \{Suck Joo\}",

year = "2008",

language = "英语",

volume = "580-582",

pages = "v",

journal = "Materials Science Forum",

issn = "0255-5476",

publisher = "Trans Tech Publications Ltd",

note = "International Welding/Joining Conference-Korea 2007, IWJC 2007 ; Conference date: 10-05-2007 Through 12-05-2007",

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TY - JOUR

T1 - Materials Science Forum - Advanced Welding and Micro Joining/Packaging for the 21st Century - Selected peer reviewed papers from the International Welding/Joining Conference-Korea 2007, IWJC 2007

T2 - International Welding/Joining Conference-Korea 2007, IWJC 2007

AU - Park, Dong Hwan

AU - Na, Suck Joo

PY - 2008

Y1 - 2008

UR - https://www.scopus.com/pages/publications/55849144767

M3 - 社论

AN - SCOPUS:55849144767

SN - 0255-5476

VL - 580-582

SP - v

JO - Materials Science Forum

JF - Materials Science Forum

Y2 - 10 May 2007 through 12 May 2007

ER -