跳到主要导航 跳到搜索 跳到主要内容

Localized corrosion: Passive film breakdown vs. Pit growth stability: Part III. A unifying set of principal parameters and criteria for pit stabilization and salt film formation

  • Ohio State University
  • University of Virginia

科研成果: 期刊稿件文章同行评审

140 引用 (Scopus)

摘要

The framework for pit stability established in Part II of this series is elaborated upon and expanded. The maximum pit dissolution current density, idiff,max, which depends on temperature and maximum potential at the pit surface in a given pit environment, is proposed and compared with the diffusion current density to determine the conditions for pit stability and salt film formation. For an open pit, the criterion for pit stability is that idiss,max must be greater than or equal to the critical diffusion current density required for maintaining a critical local environment for active dissolution, idiff,crit. The critical condition of idiss,max = idiff,crit is associated with three parameters that must be exceeded for stabilization of an open pit: critical temperature Tcrit, critical potential Ecrit and critical pit depth rcrit. Analogously, the criterion for salt film formation is idiss,max must further exceed the diffusion-limited current density ilim, and three parameters associated with salt film formation are: saturation temperature Tsat, saturation potential Esat and saturation pit depth rsat. Unifying criteria for control of pit growth by charge transfer or diffusion are proposed, which provide interrelationships for all principle parameters. The pit stability criteria for covered pits, such as metastable pits, are also described.

源语言英语
页(从-至)C762-C770
期刊Journal of the Electrochemical Society
165
11
DOI
出版状态已出版 - 2018
已对外发布

联合国可持续发展目标

此成果有助于实现下列可持续发展目标:

  1. 可持续发展目标 7 - 经济适用的清洁能源
    可持续发展目标 7 经济适用的清洁能源

学术指纹

探究 'Localized corrosion: Passive film breakdown vs. Pit growth stability: Part III. A unifying set of principal parameters and criteria for pit stabilization and salt film formation' 的科研主题。它们共同构成独一无二的学术指纹。

引用此