@inproceedings{a3a59dce59034c3b9d889e2fdfbae15b,
title = "Laser micro-structuring of sapphire wafer and fiber",
abstract = "Currently, sapphire is widely used in the field of optoelectronic devices and micro-mechanical components. One of the problems in using sapphire is the difficulty in cutting and micro-structuring due to the hardness of sapphire itself. In this paper, laser micromachining characteristics of sapphire are investigated using 157nm DUV laser micro-ablation system. Under laser fluence of 3-4 J/cm2, the maximum ablation rate could reach to 400nm/s. For 3D laser ablation, it is necessary to select a proper combination of process parameters. Several 3D micro-structures are produced in sapphire wafers and sapphire fibers. As a whole, the ablation equality is good for use.",
keywords = "157nm laser, Deep ultraviolet laser, Micro-structuring, Sapphire fiber, Sapphire wafer",
author = "Yutang Dai and Gang Xu and Jianlei Cui and Fan Bai",
year = "2010",
doi = "10.1117/12.841098",
language = "英语",
isbn = "9780819479860",
series = "Proceedings of SPIE - The International Society for Optical Engineering",
booktitle = "Micromachining and Microfabrication Process Technology XV",
note = "Micromachining and Microfabrication Process Technology XV ; Conference date: 26-01-2010 Through 26-01-2010",
}