Investigation of the Microstructure and Rolling Texture Evolution of Cu-45 at.% Ni Alloys during the Recovery Process by Quasi-In Situ Electron Backscatter Diffraction

The quasi-in situ electron backscatter diffraction method was used to investigate the microstructure and orientation evolution of Cu-45 at.% Ni alloy during the recovery process. For the first time, the “triple junction” movement theory was verified in a Cu-Ni alloy instead of in the pure metal. The “Y-junction” movement was found to be the dominant recovery mechanism in the common lamellar grains. However, this theory did not apply to grains in the area deformed by shear. Unlike the microstructure evolution, the orientation evolution was the same in the areas not deformed and deformed by shear. All the Goss orientations were swallowed by other orientations, whereas all the cube orientations swallowed other orientations. This study helped better understand the recovery process in Cu-Ni and other face-centered cubic alloys after rolling and annealing processes.