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Interfacial Dynamic Oxygen Exchange Preserves C─O Bonds for Selective CO2-to-Ethanol Electrosynthesis

  • Jiwei Li
  • , Jiaying He
  • , Deyu Zhu
  • , Chenfeng Xia
  • , Mingzhi Wang
  • , Liang Dong
  • , Lebin Cai
  • , Wensheng Fang
  • , Yaqiong Su
  • , Fei Song
  • , Wei Guo
  • , Bao Yu Xia
  • Huazhong University of Science and Technology
  • National Innovation Platform (Center) for Industry-Education Integration of Energy Storage Technology
  • CAS - Shanghai Advanced Research Institute
  • Liaoning Binhai Laboratory

科研成果: 期刊稿件 › 文章 › 同行评审

摘要

Intermediate-valence copper (Cu+) is essential for preserving C─O bonds during the electrochemical reduction of CO2 to ethanol, yet its progressive over-reduction to Cu0 under operating potentials inevitably dictates C─O bond cleavage and shifts selectivity toward ethylene. Herein, we propose an interfacial dynamic oxygen exchange strategy to stabilize Cu+ sites and steer the ethanol reaction pathway. We realize this mechanism by engineering a few-layer ceria-coated cuprous oxide (Cu2O@CeO2) catalyst featuring an oxygen vacancy-rich heterointerface (Ce−OV−Cu). Operando spectroscopic measurements and density functional theory calculations reveal that these interfacial oxygen vacancies act as core mediators; by continuously capturing and migrating oxygen species derived from CO2, they effectively arrest the reduction of adjacent Cu+ siteversuss. Crucially, this dynamic interface dictates the asymmetric C─C coupling of *CH2 and *CHO, successfully preserving the C−O bond during the subsequent protonation of *CH2CHO to *CH3CHO. Consequently, the optimized catalyst delivers an outstanding ethanol Faradaic efficiency of 68.5% at −1.1 V versus RHE and exhibits robust operational stability exceeding 150 h, substantially outperforming pristine Cu2O. This study establishes vacancy-mediated dynamic oxygen exchange as a robust strategy for preserving key oxygen-containing functional groups in highly selective CO2-to-ethanol electrosynthesis.

源语言英语
期刊Advanced Materials
DOI
出版状态已接受/待刊 - 2026
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