Interaction mechanism of thermal and mechanical field in KDP fly-cutting process

As an important nonlinear optical material, potassium dihydrogen phosphate (KDP) crystal is used in high-power laser beams as the core element of inertial confinement fusion. It is the most general method of single point diamond fly-cutting (SPDF) to produce high precision and crack-free KDP surfaces. Nevertheless, the cutting mechanism of such material remains unclear, and therefore needs further analysis. Firstly, the stress field, cutting force and cutting temperature under different working conditions are calculated by a KDP crystal cutting simulation model. Then, the rules and the cause of change and interaction mechanisms of force and temperature are analyzed by comparing the measurement experiments with simulations. Furthermore, the causes of chip formation and micro-cracks on the machined surface are analyzed based on thermo-mechanical coupling and chip morphology. The conclusion can be deduced: Although the temperature has not reached the phase transition temperature during the finishing process, under high cutting speeds and large unformed chip thickness, such as semi-finishing and roughing, the temperature can reach up to 180 °C or higher, and KDP crystals are very likely to phase transition-chip morphology also verifies this phenomenon.