In situ TEM study on crack propagation in nanoscale Au thin films

Hongtao Wang; Anmin Nie; Jiabin Liu; Peng Wang; Wei Yang; Bangdao Chen; Hongzhong Liu; Maosen Fu

doi:10.1016/j.scriptamat.2011.05.009

In situ TEM study on crack propagation in nanoscale Au thin films

Hongtao Wang
, Anmin Nie
, Jiabin Liu
, Peng Wang
, Wei Yang
, Bangdao Chen
, Hongzhong Liu
, Maosen Fu

机械工程学院

科研成果: 期刊稿件 › 文章 › 同行评审

31 引用（Scopus）

摘要

In situ straining in nanocrystalline Au thin films reveals a new fracture mechanism, i.e. crack propagation by atomic migration. The crack propagates by repetitively nucleating and moving atomic steps from the tip region to the crack rear. The stress concentration at the tip helps in the step nucleation process. The elastic energy density at the notch root decreases with increasing notch angle, which implies cracks with small angles can propagate along grain boundaries more easily.

源语言	英语
页（从-至）	377-379
页数	3
期刊	Scripta Materialia
卷	65
期	5
DOI	https://doi.org/10.1016/j.scriptamat.2011.05.009
出版状态	已出版 - 9月 2011

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10.1016/j.scriptamat.2011.05.009

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title = "In situ TEM study on crack propagation in nanoscale Au thin films",

abstract = "In situ straining in nanocrystalline Au thin films reveals a new fracture mechanism, i.e. crack propagation by atomic migration. The crack propagates by repetitively nucleating and moving atomic steps from the tip region to the crack rear. The stress concentration at the tip helps in the step nucleation process. The elastic energy density at the notch root decreases with increasing notch angle, which implies cracks with small angles can propagate along grain boundaries more easily.",

keywords = "Fracture, In situ microscopy, Migration, Thin film",

author = "Hongtao Wang and Anmin Nie and Jiabin Liu and Peng Wang and Wei Yang and Bangdao Chen and Hongzhong Liu and Maosen Fu",

year = "2011",

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T1 - In situ TEM study on crack propagation in nanoscale Au thin films

AU - Wang, Hongtao

AU - Nie, Anmin

AU - Liu, Jiabin

AU - Wang, Peng

AU - Yang, Wei

AU - Chen, Bangdao

AU - Liu, Hongzhong

AU - Fu, Maosen

PY - 2011/9

Y1 - 2011/9

N2 - In situ straining in nanocrystalline Au thin films reveals a new fracture mechanism, i.e. crack propagation by atomic migration. The crack propagates by repetitively nucleating and moving atomic steps from the tip region to the crack rear. The stress concentration at the tip helps in the step nucleation process. The elastic energy density at the notch root decreases with increasing notch angle, which implies cracks with small angles can propagate along grain boundaries more easily.

AB - In situ straining in nanocrystalline Au thin films reveals a new fracture mechanism, i.e. crack propagation by atomic migration. The crack propagates by repetitively nucleating and moving atomic steps from the tip region to the crack rear. The stress concentration at the tip helps in the step nucleation process. The elastic energy density at the notch root decreases with increasing notch angle, which implies cracks with small angles can propagate along grain boundaries more easily.

KW - Fracture

KW - In situ microscopy

KW - Migration

KW - Thin film

UR - https://www.scopus.com/pages/publications/79959937825

U2 - 10.1016/j.scriptamat.2011.05.009

DO - 10.1016/j.scriptamat.2011.05.009

M3 - 文章

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VL - 65

SP - 377

EP - 379

JO - Scripta Materialia

JF - Scripta Materialia

IS - 5

ER -

In situ TEM study on crack propagation in nanoscale Au thin films

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