Hybrid packaging of a monolithic multi-sensor

In order to satisfy the different packaging requirement of individual sensors in the monolithic multi-sensor chip, a hybrid packaging method is presented in the paper. The packaging method of multi-sensor makes use of high-resolution stereolithography system of photopatternable resin constructing the main packaging structure in the way of batch production, low cost and good resolution. A monolithic multi-sensor which consists of three-axis accelerometer, absolute pressure sensor and temperature sensor is encapsulated by the hybrid packaging method. The hybrid packaging structure which is composed of the packaging ring, silicon cap, silicone sealant and soft silicone gel, can simultaneously provide direct interaction between pressure sensor and the pressure variable to be measured as well as keep hermetic insulation for accelerometer and mechanical protection for the temperature sensor and all electrically components in the multi-sensor chip. The packaging ring which is the most important part in the hybrid packaging structure is fabricated by using high-resolution stereolithography system of photopatternable resin. At last the measure results show the hybrid packaging method is appropriate for the package of the monolithic multi-sensor chip. It has potential to be applied to a variety of multi-sensor.