High temperature silicon-on-insulator piezoresistive pressure sensitive chip

High temperature silicon-on-insulator piezoresistive pressure sensitive chip, which possesses the properties of high accuracy and high response frequency, is developed by micro electro-mechanical system technology. According to the sensitive chip mask structure, the structural dimensions and natural frequency of the sensitive chip are evaluated and analyzed based on small deflection bending theory of elastic thin plate. The sensitive chip is packaged on pyrex glass ring to form inverted-cup type elastic-sensitive cell. The pyrex glass ring effect on performance of the sensitive chip is simulated by finite element method. According to the temperatural experiment data and calculation, the absolute values of thermal zero drifts of the sensitive chip under various temperature are all less than 0.02% FS · °C^-1, which demonstrates that the accuracy of the sensitive chip gets better than 0.1% FS · °C^-1 with fine zero stability.