High-resolution wet etching technology of thick electroless nickel alloy film for MEMS devices and packaging

Y. Zhang; Q. S. Zhu; T. Itoh; R. Maeda; A. Toda

doi:10.1109/ICEPT.2013.6756498

High-resolution wet etching technology of thick electroless nickel alloy film for MEMS devices and packaging

Y. Zhang
, Q. S. Zhu
, T. Itoh
, R. Maeda
, A. Toda

National Institute of Advanced Industrial Science and Technology
Meltex Inc.

科研成果: 会议稿件 › 论文 › 同行评审

2 引用（Scopus）

摘要

In this paper, we present a high-resolution wet etching technology of 1.5 μm-thick electroless nickel alloy film. The minimum feature size was successfully reduced to about 10 μm. The developed etching technology is well compatible to conventional micro-electro-mechanical systems (MEMS) processes, and has been successfully utilized on the 4-inch wafer as well. It could be expected more practical application of electroless nickel alloy film in not only MEMS but also electronic packaging.

源语言	英语
页	396-399
页数	4
DOI	https://doi.org/10.1109/ICEPT.2013.6756498
出版状态	已出版 - 2013
已对外发布	是
活动	2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013 - Dalian, 中国期限: 11 8月 2013 → 14 8月 2013

会议

会议	2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013
国家/地区	中国
市	Dalian
时期	11/08/13 → 14/08/13

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10.1109/ICEPT.2013.6756498

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abstract = "In this paper, we present a high-resolution wet etching technology of 1.5 μm-thick electroless nickel alloy film. The minimum feature size was successfully reduced to about 10 μm. The developed etching technology is well compatible to conventional micro-electro-mechanical systems (MEMS) processes, and has been successfully utilized on the 4-inch wafer as well. It could be expected more practical application of electroless nickel alloy film in not only MEMS but also electronic packaging.",

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author = "Y. Zhang and Zhu, \{Q. S.\} and T. Itoh and R. Maeda and A. Toda",

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T1 - High-resolution wet etching technology of thick electroless nickel alloy film for MEMS devices and packaging

AU - Zhang, Y.

AU - Zhu, Q. S.

AU - Itoh, T.

AU - Maeda, R.

AU - Toda, A.

PY - 2013

Y1 - 2013

N2 - In this paper, we present a high-resolution wet etching technology of 1.5 μm-thick electroless nickel alloy film. The minimum feature size was successfully reduced to about 10 μm. The developed etching technology is well compatible to conventional micro-electro-mechanical systems (MEMS) processes, and has been successfully utilized on the 4-inch wafer as well. It could be expected more practical application of electroless nickel alloy film in not only MEMS but also electronic packaging.

AB - In this paper, we present a high-resolution wet etching technology of 1.5 μm-thick electroless nickel alloy film. The minimum feature size was successfully reduced to about 10 μm. The developed etching technology is well compatible to conventional micro-electro-mechanical systems (MEMS) processes, and has been successfully utilized on the 4-inch wafer as well. It could be expected more practical application of electroless nickel alloy film in not only MEMS but also electronic packaging.

KW - electroless

KW - micro-electro-mechanical systems

KW - nickel

KW - wet etching

UR - https://www.scopus.com/pages/publications/84898038224

U2 - 10.1109/ICEPT.2013.6756498

DO - 10.1109/ICEPT.2013.6756498

M3 - 论文

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T2 - 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013

Y2 - 11 August 2013 through 14 August 2013

ER -

High-resolution wet etching technology of thick electroless nickel alloy film for MEMS devices and packaging

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