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High Electric Field Conduction of Polymers at Ambient and Elevated Temperatures

  • Chao Wu
  • , Zongze Li
  • , Lihua Chen
  • , Ajinkya Deshmukh
  • , Yifei Wang
  • , Rampi Ramprasad
  • , Gregory A. Sotzing
  • , Yang Cao
  • University of Connecticut
  • Georgia Institute of Technology

科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审

4 引用 (Scopus)

摘要

The next generation electrical-power and electronic systems with wide band gap semiconductors require thin dielectric films operating under the extreme electric field at elevated temperatures. Here we investigated the conduction properties under high electric field up to 450 MV/m for biaxially oriented polypropylene (BOPP), which is the state-of-the-art commercially available polymer for capacitive applications, as well as three high-temperature polymers poly(ether ether ketone)(PEEK), poly(etherimide)(Ultem) and polyimide(Kapton). Further analysis was performed based on the hopping conduction mechanism. At elevated temperature, the increased thermally-assisted excitation energy gave rise to an increase of the hopping distance. It is argued that the large band gap provided a higher energy barrier to the charge hopping. If the band gap is large enough, the tunneling process dominated the charge transport, i.e., the case of BOPP. For high-temperature applications, both the thermal stability and large band gap are required in order to suppress the temperature and electric field dependent conduction.

源语言英语
主期刊名2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2019 - Proceedings
出版商Institute of Electrical and Electronics Engineers Inc.
页486-489
页数4
ISBN(电子版)9781728131214
DOI
出版状态已出版 - 10月 2019
已对外发布是
活动2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2019 - Richland, 美国
期限: 20 10月 2019 → 23 10月 2019

丛书

姓名Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP
卷2019-October
ISSN(印刷版)0084-9162

会议

会议2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2019
国家/地区美国
市Richland
时期20/10/19 → 23/10/19

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