High-efficient cooling from a counter-flow microchannel heat sink with sinusoidal wave walls for high-performance electronic devices

Flow boiling heat transfer in microchannels is an efficient thermal management solution. In this work, a counter-flow microchannel with sinusoidal wave walls (CFSWM) is proposed. Compared with the traditional microchannel, the heat flux and heat transfer coefficient (HTC) of CFSWM are increased by 49 % and 103 %, respectively. A high heat dissipation of 305 W/cm² and an HTC of 64.2 kW/(m²·K) are achieved while keeping a pressure drop below 12 kPa. The counter-flow design enhances the heat exchange between adjacent channels and delays heat transfer deterioration caused by downstream wall overheating, eliminating backflow phenomenon under all operating conditions. The pressure drop is reduced by 21 % and the coefficient of performance (COP) is increased by 36 %. The wall temperature uniformity has significantly improved, and the maximum wall temperature difference is reduced by 74 %. The sinusoidal wave wall significantly increases the effective heat transfer area and improves the liquid film evaporation efficiency, achieving a wall temperature reduction of 5.4∼9.4 °C at the same heat flux.