Heterogeneous Design Method of Thermal Conductivity for Enhancing the Thermal Contact Performance of Assembly Interfaces

To address the inadequate heat dissipation and operational performance caused by insufficient contact thermal performance at assembly interfaces, this study first establishes a numerical analysis model for contact thermal performance based on measured rough surface topography of assembly interfaces. Subsequently, contact thermal resistance under corresponding pressure and temperature conditions is tested to verify the accuracy of the numerical model. Finally, starting from the microscopic heat transfer mechanism at the assembly interface, a heterogeneous design approach for thermal conductivity is proposed, establishing a progressive iterative optimization design method for the thermal conductivity of assembly interfaces. The results demonstrate that the constructed numerical analysis model for contact thermal performance can achieve high-precision predictions, with a relative error of 15.52%. The heterogeneous design of thermal conductivity effectively reduces contact thermal resistance by improving the uniformity of temperature gradient distribution at the interface, resulting in a 23.12% improvement in contact thermal performance after optimization. This study provides new technical support for ensuring the contact thermal performance and overall heat dissipation in thermally sensitive complex mechanical products, such as electronic chip packaging and aerospace vehicles.