TY - GEN
T1 - Hardware design of a 1.7 kV SiC MOSFET based MMC for medium voltage motor drives
AU - Li, He
AU - Potty, Karun
AU - Ke, Ziwei
AU - Pan, Jianyu
AU - Chen, Yingzhuo
AU - Zhang, Fan
AU - Sabbagh, Muneer Al
AU - Perdikakis, Will
AU - Li, Gengyao
AU - Ye, Xi
AU - Na, Risha
AU - Zhang, Julia
AU - Xu, Longya
AU - Wang, Jin
N1 - Publisher Copyright:
© 2018 IEEE.
PY - 2018/4/18
Y1 - 2018/4/18
N2 - This paper presents the hardware design of a 7 kV dc bus, 1 MVA, 0-1,000 Hz, 1.7 kV SiC MOSFET based medium voltage variable speed drive (MVVSD)1. The system is based on a 7-level three-phase modular multilevel converter (MMC). The full in-depth design, development, and testing of this prototype are provided, including MMC submodule development, arm inductor design, control hardware realization, system integration and thermal analysis. Finally, experimental results demonstrate the excellent performance of the 1.7 kV SiC MOSFET based submodule and the 1 MW, 7 kV MVVSD as a unity in various operation modes.
AB - This paper presents the hardware design of a 7 kV dc bus, 1 MVA, 0-1,000 Hz, 1.7 kV SiC MOSFET based medium voltage variable speed drive (MVVSD)1. The system is based on a 7-level three-phase modular multilevel converter (MMC). The full in-depth design, development, and testing of this prototype are provided, including MMC submodule development, arm inductor design, control hardware realization, system integration and thermal analysis. Finally, experimental results demonstrate the excellent performance of the 1.7 kV SiC MOSFET based submodule and the 1 MW, 7 kV MVVSD as a unity in various operation modes.
KW - Medium Voltage
KW - Modular Multilevel Converter
KW - Motor Drive
KW - SiC MOSFET
UR - https://www.scopus.com/pages/publications/85046972015
U2 - 10.1109/APEC.2018.8341238
DO - 10.1109/APEC.2018.8341238
M3 - 会议稿件
AN - SCOPUS:85046972015
T3 - Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC
SP - 1649
EP - 1655
BT - APEC 2018 - 33rd Annual IEEE Applied Power Electronics Conference and Exposition
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 33rd Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2018
Y2 - 4 March 2018 through 8 March 2018
ER -