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Fragmented chip formation mechanism in high-speed cutting from the perspective of stress wave effect

  • Xi'an Jiaotong University
  • Arts et Métiers ParisTech

科研成果: 期刊稿件文章同行评审

15 引用 (Scopus)

摘要

In this study, fragmented chip formation mechanism in high speed cutting (HSC) process is explored by using continuum-based discrete element method (DEM) based on the stress wave theory. The continuum-based DEM model established with Godunov frame is suitable for capturing multiple cracks propagation under high-speed impact. The chip forming mechanism based on stress wave theory is quantitatively analysed by DEM simulations against experimental data, which shows that the unloading wave reflected by the free surface of chips under high-speed conditions has a fundamental influence on chip formation.

源语言英语
页(从-至)53-56
页数4
期刊CIRP Annals
70
1
DOI
出版状态已出版 - 1月 2021

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