摘要
In this study, fragmented chip formation mechanism in high speed cutting (HSC) process is explored by using continuum-based discrete element method (DEM) based on the stress wave theory. The continuum-based DEM model established with Godunov frame is suitable for capturing multiple cracks propagation under high-speed impact. The chip forming mechanism based on stress wave theory is quantitatively analysed by DEM simulations against experimental data, which shows that the unloading wave reflected by the free surface of chips under high-speed conditions has a fundamental influence on chip formation.
| 源语言 | 英语 |
|---|---|
| 页(从-至) | 53-56 |
| 页数 | 4 |
| 期刊 | CIRP Annals |
| 卷 | 70 |
| 期 | 1 |
| DOI | |
| 出版状态 | 已出版 - 1月 2021 |
学术指纹
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