TY - JOUR
T1 - First principle study on thermoelectrical properties of silicon nanostructures
AU - Li, Yifei
AU - Fu, Bo
AU - Tang, Guihua
N1 - Publisher Copyright:
© 2018 International Heat Transfer Conference. All rights reserved.
PY - 2018
Y1 - 2018
N2 - Nanostructuring and carrier concentration optimization have been widely employed to improve thermoelectrical properties. Nanostructures can enhance phonon-boundary scattering, and adjusting carrier concentration can affect the phonon-electron scattering. In this work, we investigated the structure, electron and phonon properties of silicon thin films to obtain the dimensionless figure of merit (ZT value). The first-principle calculations were employed to obtain all the electron and phonon properties with Quantum Espresso package. The electron-phonon scattering rates were obtained based on an interpolation scheme using maximally localized Wannier functions with the aid of EPW package. We performed frequency-dependent simulations of thermal transport in silicon thin films by numerically solving the phonon Boltzmann Transport Equation with the Discrete Ordinate Method. The Seebeck coefficient and electrical conductivity are calculated by solving the electron Boltzmann Transport Equation with the BoltzTrap package using relaxation time approximation (RTA). The results show that the ZT value of silicon increases effectively as the feature size of silicon thin films goes down. The lattice thermal conductivity reductions due to the electron-phonon scattering, decrease as the feature size of silicon thin films fall and could be ignored at low feature sizes (20 nm for silicon thin films). The results also provide an optimal carrier concentration at which the highest ZT value can be achieved. The nanostructuring technology and carrier concentration optimization method can be chosen or combined more reasonably for reducing the thermal conductivity and increasing the ZT value of thermoelectric materials.
AB - Nanostructuring and carrier concentration optimization have been widely employed to improve thermoelectrical properties. Nanostructures can enhance phonon-boundary scattering, and adjusting carrier concentration can affect the phonon-electron scattering. In this work, we investigated the structure, electron and phonon properties of silicon thin films to obtain the dimensionless figure of merit (ZT value). The first-principle calculations were employed to obtain all the electron and phonon properties with Quantum Espresso package. The electron-phonon scattering rates were obtained based on an interpolation scheme using maximally localized Wannier functions with the aid of EPW package. We performed frequency-dependent simulations of thermal transport in silicon thin films by numerically solving the phonon Boltzmann Transport Equation with the Discrete Ordinate Method. The Seebeck coefficient and electrical conductivity are calculated by solving the electron Boltzmann Transport Equation with the BoltzTrap package using relaxation time approximation (RTA). The results show that the ZT value of silicon increases effectively as the feature size of silicon thin films goes down. The lattice thermal conductivity reductions due to the electron-phonon scattering, decrease as the feature size of silicon thin films fall and could be ignored at low feature sizes (20 nm for silicon thin films). The results also provide an optimal carrier concentration at which the highest ZT value can be achieved. The nanostructuring technology and carrier concentration optimization method can be chosen or combined more reasonably for reducing the thermal conductivity and increasing the ZT value of thermoelectric materials.
KW - Electron-phonon scattering
KW - First principle
KW - Nanostructuring
KW - Silicon
KW - Thermoelectric materials
UR - https://www.scopus.com/pages/publications/85068348684
U2 - 10.1615/ihtc16.mpe.022250
DO - 10.1615/ihtc16.mpe.022250
M3 - 会议文章
AN - SCOPUS:85068348684
SN - 2377-424X
VL - 2018-August
SP - 5943
EP - 5951
JO - International Heat Transfer Conference
JF - International Heat Transfer Conference
T2 - 16th International Heat Transfer Conference, IHTC 2018
Y2 - 10 August 2018 through 15 August 2018
ER -