TY - JOUR
T1 - Feasibility assessment of water as a means of constructing a novel contact melting method
T2 - A numerical study
AU - Huang, Xinyu
AU - Xie, Yuan
AU - Gao, Jiayi
AU - Liu, Zhengguang
AU - Yang, Xiaohu
AU - Sundén, Bengt
N1 - Publisher Copyright:
© 2025 Taylor & Francis Group, LLC.
PY - 2025
Y1 - 2025
N2 - This study proposes a novel contact melting mode based on the incompatibility of water and paraffin. This mode involves filling a small amount of water at the bottom of the unit to expedite paraffin melting through the high thermal conductivity of water while also utilizing water as a heat storage medium. A 2-D numerical model is developed using the enthalpy-porosity method to account for natural convection between paraffin and water and to verify the relevant model. The study compares the impact of varying water filling heights on the melting performance (liquid phase distribution, velocity distribution, temperature distribution, total melting time, heat storage rate, and rate of different heat storage media) of the phase change heat storage unit. The results indicate that the contact melting mode, achieved by filling water at different heights at the bottom of the unit, gradually enhances heat transfer with increasing water height. However, increased water volume negatively impacts total heat storage. Specifically, compared to a pure paraffin structure, it is found that when water occupies 10% of the total volume, the melting time is reduced by 8.60%, and the overall heat storage rate (PCM + water) is increased by 4.05%, yet overall heat storage is reduced by 5.16%. Furthermore, when the volume of water is 5%, an increase in initial water temperature is advantageous for the heat storage rate of PCM at the initial melting stage, resulting in a shortened total melting time. However, this comes at the expense of the heat storage and heat storage rate of water. Moreover, an increase in the heat source temperature from 342.15 K to 357.15 K reduces melting time by 36.83%, an increase in the average heat storage rate of PCM by 73.20%, and a substantial improvement in overall heat storage.
AB - This study proposes a novel contact melting mode based on the incompatibility of water and paraffin. This mode involves filling a small amount of water at the bottom of the unit to expedite paraffin melting through the high thermal conductivity of water while also utilizing water as a heat storage medium. A 2-D numerical model is developed using the enthalpy-porosity method to account for natural convection between paraffin and water and to verify the relevant model. The study compares the impact of varying water filling heights on the melting performance (liquid phase distribution, velocity distribution, temperature distribution, total melting time, heat storage rate, and rate of different heat storage media) of the phase change heat storage unit. The results indicate that the contact melting mode, achieved by filling water at different heights at the bottom of the unit, gradually enhances heat transfer with increasing water height. However, increased water volume negatively impacts total heat storage. Specifically, compared to a pure paraffin structure, it is found that when water occupies 10% of the total volume, the melting time is reduced by 8.60%, and the overall heat storage rate (PCM + water) is increased by 4.05%, yet overall heat storage is reduced by 5.16%. Furthermore, when the volume of water is 5%, an increase in initial water temperature is advantageous for the heat storage rate of PCM at the initial melting stage, resulting in a shortened total melting time. However, this comes at the expense of the heat storage and heat storage rate of water. Moreover, an increase in the heat source temperature from 342.15 K to 357.15 K reduces melting time by 36.83%, an increase in the average heat storage rate of PCM by 73.20%, and a substantial improvement in overall heat storage.
KW - Close contact melting
KW - PCM-water
KW - enhanced heat transfer
KW - latent heat storage
KW - natural convection
UR - https://www.scopus.com/pages/publications/105008966615
U2 - 10.1080/10407782.2025.2522313
DO - 10.1080/10407782.2025.2522313
M3 - 文章
AN - SCOPUS:105008966615
SN - 1040-7782
JO - Numerical Heat Transfer; Part A: Applications
JF - Numerical Heat Transfer; Part A: Applications
ER -