Fabrication of Ni-w electroformed mold for thermal imprint of borosilicate glass

Manabu Yasui; Satoru Kaneko; Masaharu Takahashi; Hiroaki Ito; Masahiro Arai; Yasuo Hirabayashi; Takeshi Ozawa; Ryutaro Maeda

doi:10.1299/kikaia.79.507

Fabrication of Ni-w electroformed mold for thermal imprint of borosilicate glass

Manabu Yasui
, Satoru Kaneko
, Masaharu Takahashi
, Hiroaki Ito
, Masahiro Arai
, Yasuo Hirabayashi
, Takeshi Ozawa
, Ryutaro Maeda

Kanagawa Institute of Industrial Science and Technology

科研成果: 期刊稿件 › 文章 › 同行评审

摘要

We proposed an electroformed mold for thermal imprint of borosilicate glass in this paper. The mold was made of Ni-W electrodeposition film that was superior to heat-resistance and removing glass. The resist pattern for electroforming was fabricated with SU8-10. Ni-W solution for electroforming was developed by mixing nickel sulfamate, tungsten sodium and citric acid. The minimum pitch and the height of the pattern on Ni-W electroformed mold were about 40 urn and 3.8 um, respectively. The thermal imprint for borosilicate glass carried out with Ni-W electroformed mold. The shape of the Ni-W electroformed mold was printed on the borosilicate glass by thermal imprint. The borosilicate glass was removed from the Ni-W electroformed mold easily.

源语言	英语
页（从-至）	507-511
页数	5
期刊	Nihon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A
卷	79
期	800
DOI	https://doi.org/10.1299/kikaia.79.507
出版状态	已出版 - 2013
已对外发布	是

访问文件

10.1299/kikaia.79.507

其它文件与链接

链接到 Scopus 的出版物

引用此

@article{3257217961554734bc4891f6431f6185,

title = "Fabrication of Ni-w electroformed mold for thermal imprint of borosilicate glass",

abstract = "We proposed an electroformed mold for thermal imprint of borosilicate glass in this paper. The mold was made of Ni-W electrodeposition film that was superior to heat-resistance and removing glass. The resist pattern for electroforming was fabricated with SU8-10. Ni-W solution for electroforming was developed by mixing nickel sulfamate, tungsten sodium and citric acid. The minimum pitch and the height of the pattern on Ni-W electroformed mold were about 40 urn and 3.8 um, respectively. The thermal imprint for borosilicate glass carried out with Ni-W electroformed mold. The shape of the Ni-W electroformed mold was printed on the borosilicate glass by thermal imprint. The borosilicate glass was removed from the Ni-W electroformed mold easily.",

keywords = "Borosilicate Glass, Electroforming Mold, Ni-W, Thermal Imprinting",

author = "Manabu Yasui and Satoru Kaneko and Masaharu Takahashi and Hiroaki Ito and Masahiro Arai and Yasuo Hirabayashi and Takeshi Ozawa and Ryutaro Maeda",

year = "2013",

doi = "10.1299/kikaia.79.507",

language = "英语",

volume = "79",

pages = "507--511",

journal = "Nihon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A",

issn = "0387-5008",

publisher = "Japan Society of Mechanical Engineers",

number = "800",

}

TY - JOUR

T1 - Fabrication of Ni-w electroformed mold for thermal imprint of borosilicate glass

AU - Yasui, Manabu

AU - Kaneko, Satoru

AU - Takahashi, Masaharu

AU - Ito, Hiroaki

AU - Arai, Masahiro

AU - Hirabayashi, Yasuo

AU - Ozawa, Takeshi

AU - Maeda, Ryutaro

PY - 2013

Y1 - 2013

N2 - We proposed an electroformed mold for thermal imprint of borosilicate glass in this paper. The mold was made of Ni-W electrodeposition film that was superior to heat-resistance and removing glass. The resist pattern for electroforming was fabricated with SU8-10. Ni-W solution for electroforming was developed by mixing nickel sulfamate, tungsten sodium and citric acid. The minimum pitch and the height of the pattern on Ni-W electroformed mold were about 40 urn and 3.8 um, respectively. The thermal imprint for borosilicate glass carried out with Ni-W electroformed mold. The shape of the Ni-W electroformed mold was printed on the borosilicate glass by thermal imprint. The borosilicate glass was removed from the Ni-W electroformed mold easily.

AB - We proposed an electroformed mold for thermal imprint of borosilicate glass in this paper. The mold was made of Ni-W electrodeposition film that was superior to heat-resistance and removing glass. The resist pattern for electroforming was fabricated with SU8-10. Ni-W solution for electroforming was developed by mixing nickel sulfamate, tungsten sodium and citric acid. The minimum pitch and the height of the pattern on Ni-W electroformed mold were about 40 urn and 3.8 um, respectively. The thermal imprint for borosilicate glass carried out with Ni-W electroformed mold. The shape of the Ni-W electroformed mold was printed on the borosilicate glass by thermal imprint. The borosilicate glass was removed from the Ni-W electroformed mold easily.

KW - Borosilicate Glass

KW - Electroforming Mold

KW - Ni-W

KW - Thermal Imprinting

UR - https://www.scopus.com/pages/publications/84876903176

U2 - 10.1299/kikaia.79.507

DO - 10.1299/kikaia.79.507

M3 - 文章

AN - SCOPUS:84876903176

SN - 0387-5008

VL - 79

SP - 507

EP - 511

JO - Nihon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A

JF - Nihon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A

IS - 800

ER -

Fabrication of Ni-w electroformed mold for thermal imprint of borosilicate glass

摘要

访问文件

其它文件与链接

学术指纹

引用此